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-TI-DGN8-1760X1425TP_N

描述：SOIC, 8-Leads, Body 3x3mm, Pitch 0.65mm, Thermal Pad 1.76x1.425mm, IPC Medium Density
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名称: -TI-DGN8-1760X1425TP_N
描述: SOIC, 8-Leads, Body 3x3mm, Pitch 0.65mm, Thermal Pad 1.76x1.425mm, IPC Medium Density

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