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-TI-DGN8-1790X1470TP_N

描述：SOIC, 8-Leads, Body 3x3mm, Pitch 0.65mm, Thermal Pad 1.79X1.47mm, IPC Medium Density
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名称: -TI-DGN8-1790X1470TP_N
描述: SOIC, 8-Leads, Body 3x3mm, Pitch 0.65mm, Thermal Pad 1.79X1.47mm, IPC Medium Density

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